Method for fabricating semiconductor device having vertical-type channel

ABSTRACT

A method for fabricating a semiconductor device includes the following steps. A device isolation layer with a trench type is etched in a predetermined portion of a substrate to define an active region. Predetermined portions where gate lines traverse in the device isolation layer are etched to a certain depth to form a plurality of first recesses. A pair of gate lines filling the first recesses and traversing over the active region is formed. Portions of the active region which storage nodes contact on one sides of the gate lines are etched to form a plurality of second recesses. An ion-implantation process is performed to form a plurality of first junction regions beneath the second recesses and to form a second junction region in a portion of the active region between the gate lines such that the second junction region contacts bit lines.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present invention is a divisional of U.S. patent application Ser.No. 11/479,439, filed on Jun. 29, 2006, now U.S. Pat. No. 7,749,844which claims priority to Korean patent application number10-2005-0132568, filed on Dec. 28, 2005, both of which are incorporatedherein by reference in their entirety.

BACKGROUND OF THE INVENTION

The present invention relates to a method for fabricating asemiconductor device, and more particularly to a semiconductor devicehaving a vertical-type channel and a method for fabricating the same.

As the integration scale of semiconductor devices has been increased, anincrease in cell electric charges and an improvement in a refreshproperty have a direct relationship with reliability of dynamic randomaccess memory (DRAM) devices.

Furthermore, the DRAM devices use a cell having a horizontal-typechannel. FIG. 1 illustrates a cross-sectional view of a conventionalcell structure having a horizontal-type channel. The cell structurehaving the horizontal-type cell will be referred to as a horizontalchannel cell.

As shown in FIG. 1, a plurality of gate lines, each formed bysequentially stacking a gate oxide layer 112, a gate oxide layer 113,and a gate hard mask 114 are formed over a substrate 111. A plurality ofgate spacers 115 are formed on sidewalls of the gate lines, and aplurality of source/drain regions 116A and 116B are formed in thesubstrate 111 adjacent to the gate lines. A bit line BL is connected tothe source/drain region 116A and a plurality of storage nodes SN areconnected to the source/drain regions 116B.

In the horizontal channel cell shown in FIG. 1, a horizontal-typechannel length ‘H-CH’ is formed in the horizontal direction beneath thegate electrode 113.

However, in the DRAM devices using the horizontal-type cells with a gatewidth of 100 nm or lower, a cell size becomes smaller and a channellength of the cell becomes shorter. Accordingly, a refresh property ofthe DRAM devices gets degraded, and a gate width becomes smaller. As aresult, an operation voltage of the cell can be difficult to control andcell current reduces.

SUMMARY OF THE INVENTION

The present invention provides a semiconductor device having avertical-type channel capable of overcoming a limitation caused by achannel length according to a design rule and stably operating a cell byincreasing a cell current.

In accordance with one embodiment of the present invention, asemiconductor device includes: an active region including a surfaceregion and a first recess formed below the surface region, the activeregion extending along a first direction; a device isolation structureprovided on an edge of the active region; a gate line traversing overthe surface region of the active region along a second directionorthogonal to the first direction; a second recess formed in the deviceisolation structure to receive a given portion of the gate line into thesecond recess; a first junction region formed in the active regionbeneath the first recess and on a first side of the gate line; and asecond junction region formed on a second side of the gate line andabove the first junction region, wherein the first and second junctionregions define a vertical-type channel that extends along lateral andvertical directions.

In accordance with another embodiment of the present invention, asemiconductor device includes: an active region including a surfaceregion and first recesses formed on both sides of the surface region,the active region extending along a first direction; a device isolationstructure surrounding the active region; a pair of gate lines extendingalong the surface region of the active region in a second directionperpendicular to the first direction; a plurality of second recessesformed in the device isolation structure beneath the gate lines andincluding given portions of the gate lines filled into the secondrecesses; a plurality of first junction regions formed in the activeregion beneath the first recesses; and a second junction region formedin the surface region between the gate lines, wherein the secondjunction region defines at least two vertical-type channels below thegate line with the plurality of first junction regions.

In accordance with still another embodiment of the present invention, amethod for fabricating a semiconductor device includes: forming a deviceisolation structure within a trench type to define an active region on asubstrate; etching portions where gate lines traverse in the deviceisolation structure to a certain depth to form a plurality of firstrecesses; forming a pair of gate lines filling the first recesses andtraversing over the active region; etching a portion of the activeregion between the gate lines to a certain depth to form a secondrecess; and performing an ion-implantation process to form a firstjunction region beneath the second recess and to form second junctionregions on sides of the gate lines in a surface region of the activeregion.

In accordance with another embodiment of the present invention, a methodfor fabricating a semiconductor device includes: forming a deviceisolation layer with a trench type in a predetermined portion of asubstrate to define an active region; etching predetermined portionswhere gate lines traverse in the device isolation layer to a certaindepth to form a plurality of first recesses; forming a pair of gatelines filling the first recesses and traversing over the active region;etching portions of the active region which storage nodes contact on onesides of the gate lines to form a plurality of second recesses; andperforming an ion-implantation process to form a plurality of firstjunction regions beneath the second recesses and to form a secondjunction region in a portion of the active region between the gatelines, the second junction region contacting bit lines.

In accordance with yet another embodiment, a semiconductor deviceincludes an active region including a surface region and a first recessformed below the surface region, the active region extending along afirst direction. A device isolation structure is provided on an edge ofthe active region. A gate line traverses over the surface region of theactive region along a second direction orthogonal to the firstdirection. A second recess is formed in the device isolation structureto receive a given portion of the gate line into the second recess. Afirst junction region is formed in the active region beneath the firstrecess and on a first side of the gate line. A second junction region isformed on a second side of the gate line and above the first junctionregion. The first and second junction regions define a vertical-typechannel that extends along lateral and vertical directions.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features of the present invention will become betterunderstood with respect to the following description of the embodimentsgiven in conjunction with the accompanying drawings, in which:

FIG. 1 illustrates a cross-sectional view of a conventional cell havinga horizontal-type channel;

FIG. 2 shows a top view of a cell having a vertical-type channel inaccordance with a first embodiment of the present invention;

FIG. 3A describes a cross-sectional view of the cell taken along a lineI-I′ in FIG. 2;

FIG. 3B provides a cross-sectional view of the cell taken along a lineII-II′ in FIG. 2;

FIGS. 4A to 4E are cross-sectional views illustrating a method forfabricating the cell shown in FIGS. 2 to 3B;

FIG. 5A illustrates a perspective view of the cell shown in FIG. 4E;

FIG. 5B represents a perspective view of a vertical-type channel shownin FIG. 4E;

FIG. 6 shows a top view of a cell having a vertical-type channel inaccordance with a second embodiment of the present invention;

FIG. 7A provides a cross-sectional view of the cell taken along a lineI-I′ in FIG. 6;

FIG. 7B describes a cross-sectional view of the cell taken along a lineII-II′ in FIG. 6;

FIGS. 8A to 8E are cross-sectional views illustrating a method forfabricating the cell shown in FIGS. 6 to 7B;

FIG. 9A illustrates a perspective view of the cell structure having avertical-type channel shown in FIG. 8E; and

FIG. 9B shows a perspective view of the vertical-type channel shown inFIG. 8E.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 2 shows a top view of a cell having a vertical-type channel inaccordance with a first embodiment of the present invention. FIG. 3Adescribes a cross-sectional view of the cell taken along a line I-I′ inFIG. 2 and FIG. 3B provides a cross-sectional view of the cell takenalong a line II-II′ in FIG. 2.

Hereinafter, a semiconductor memory device having a vertical-typechannel that defines a significant vertical current path will bereferred to as “vertical channel device”. The vertical channel devicecomprises a plurality of storage cells, e.g., millions of cells.Accordingly, the term “vertical channel cell” is used to refer to aportion of the vertical channel device.

Referring to FIG. 2 and FIGS. 3A and 3B, the vertical channel device isdefined on a semiconductor substrate 221. The vertical channel deviceincludes an active region 223 having a plurality of surface regions 230Band a first recess 230A lower than the surface regions 230B. The surfaceregion 230B defines an upper surface of the substrate 221 in the presentembodiment. The first recess 230A is formed by etching a trench of agiven depth in the substrate 221.

The vertical channel device includes a device isolation layer 222surrounding the active region 223, at least one pair of gate electrodes(also known as gate lines) 227 traversing over the surface region 230Bof the active region 223 in the direction perpendicular to the activeregion 223, a plurality of second recesses 225 formed in the deviceisolation layer 222 beneath the gate electrodes 227 and includingportions of the gate electrodes 227 filling the second recesses 225.

A bit line junction region 232A is formed in the active region 223beneath the first recess region 230A and contacting a bit line. Aplurality of storage node junction regions 232B are formed in thesurface region 230B on one side of the corresponding gate electrodes 227and contacting a storage node.

A plurality of gate spacers 231 are formed over sidewalls of the gatelines. A gate oxide layer 226 is formed beneath the gate electrode 227and over the substrate 221. A gate hard mask 228 is formed above thegate electrode 227.

In the above described structure, the vertical-type channel length‘V-CH’ of the vertical channel device is defined between the bit linejunction region 232A and the storage node junction region 232B beneaththe gate electrode 227.

FIGS. 4A to 4E are cross-sectional views illustrating a method forfabricating a semiconductor device having the cell shown in FIGS. 2 to3B. The cross-sectional views associated with a line I-I′ in FIG. 2 areprovided on the left side. The cross-sectional views associated with aline II-II′ in FIG. 2 are provided on the right side.

As shown in FIG. 4A, a plurality of trench type device isolation layers422 are formed in a substrate 421. An active region 423 is defined bythe device isolation layers 422. The active region is formed in anisland type by using a shallow trench isolation (STI) process.

As shown in FIG. 4B, a photoresist layer is formed over the aboveresulting structure and patterned by performing a photo-exposure processand a developing process to form a first photoresist pattern 424. Thefirst photoresist pattern 424 is a mask formed by reversing a gate maskto pattern a subsequent gate electrode and traverses an upper portion ofthe active region 423. Accordingly, a plurality of first openings 424Abetween the first photoresist pattern 424 has a line type structureexposing a portion where a subsequent gate electrode is to be formed.

Predetermined portions of the device isolation layers 422 exposed by thefirst openings 424A by using the first photoresist pattern 424 as anetch mask are etched to form a plurality of first recesses 425. Theetching process to form the first recesses 425 is performed by using agas selectively etching the device isolation layers 422 which are formedwith an oxide-based layer. For instance, a fluorocarbon-based gasselected from a group comprising tetrafluoromethane (CF₄),octafluoropropane (C₃F₈) and trifluoromethane (CHF₃) can be used. Sincethe gas used in the etching process to form the first recesses 425 needsto have a high etch selectivity to a silicon-based active region 423,C₃F₈ or CHF₃ can also be used.

As shown in FIG. 4C, the first photoresist pattern 424 is stripped and agate oxide layer 426 is formed. Then, a plurality of gate electrodes 427and a plurality of gate hard masks 428 are sequentially formed over thefirst recesses 425 and afterwards, a gate patterning process isperformed to form a plurality of line type gate lines traversing overthe active region 423.

The gate electrodes 427 are formed with polysilicon or a stack structureof polysilicon and tungsten silicide. The gate electrodes 427sufficiently fill the first recesses 425, and a planarization processcan be additionally performed. The gate hard masks 428 are formed with asilicon nitride layer over the planarized gate electrodes 427.

During forming the above described gate lines, since the gate electrodes427 are formed with a structure filling the first recesses 425, each ofthe gate electrodes 427 covers two sidewalls of the active region 423and a top surface of the active region 423.

As shown in FIG. 4D, a photoresist layer is formed over the aboveresulting structure including the gate lines, and patterned by using aphoto-exposure process and a developing process to form a secondphotoresist pattern 429 exposing a surface of the active region 423between the gate lines. A second opening 429A of the second photoresistpattern 429 is formed with a structure exposing at least one side of thegate line or in a line type which does not expose the gate line. Asubstrate and an active region exposed by the second opening 429A areprovided with reference numerals 421A and 423A respectively.Accordingly, the second photoresist pattern 429 covers the other side ofthe gate line or a top surface of the gate line, and exposes a surfaceof the exposed active region 423A between the gate lines and apredetermined portion of the device isolation layers 422 contacting theactive region 423.

The exposed active region 423A is etched to a predetermined thickness byusing the second photoresist pattern 429 as an etch mask to form asecond recess 430A. Although explained later, a bottom portion of thesecond recess 430A will be a region contacting a bit line, and aplurality of surface region 430B of the exposed active region 423Aexcept for the second recess 430A will be a region contacting a storagenode. The second recess 430A has a major axis and a minor axis. Thesecond recess 430A exposes the sidewalls of the device isolation layers422 in the direction of the major axis, and the sidewalls of the exposedactive region 423A in the direction of the minor axis.

In some embodiments, the second recess 430A is formed more thinly thanthe first recess 425 in which the gate electrode 427 is filled to reducea leakage current.

As a result, the second recess 430A is formed with a predeterminedthickness between the gate lines. A space between the gate linesrepresents a region where a bit line will be formed. Since the etchingprocess to form the second recess 430A selectively etches the substrate421 formed with a silicon material, hydrogen bromide (HBr) or chlorine(Cl₂) gas can be used.

As shown in FIG. 4E, the second photoresist pattern 429 is stripped toform a plurality of gate spacers 431 on sidewalls of the gate lines.More specifically, a silicon nitride layer is formed and then, subjectedto an etch-back to form the gate spacers 431. On one side of each of thegate lines contacting the second recess 430A, the gate spacers 431 covernot only the sidewalls of the gate lines but also the sidewalls of thesecond recess 430A. In an upper portion of the surface region 430B, thespacers 431 cover the sidewalls of the gate lines.

An ion-implantation process using an ion-implantation barrier furthercomprising the gate lines and the gate spacers 431, or a separateion-implantation mask (not shown) is performed to form a plurality ofsource/drain regions. The source/drain region formed by performing anion-implantation process to a bottom portion of the second recess 430Abecomes a region where a subsequent bit line contacts and thus, will bereferred to as a bit line junction region 432A. The source/drain regionsformed by performing the ion-implantation process to the surface region430A of the exposed active region 423A become regions where subsequentstorage nodes contact and thus, will be referred to as storage nodejunction regions 432B. In some embodiments, the bit line junction region432A and the storage node junction regions 432B are doped with N-typeimpurities.

As described above, the bit line junction region 432A and the storagenode junction regions 432B are formed between the gate lines to form acell transistor. A channel region is defined beneath a surface of theexposed active region 423A between the bit line junction region 432A andthe respective storage node junction regions 432B. As illustrated, thechannel region has a channel length ‘V-CH’. The channel length ‘V-CH’ islonger than the conventional horizontal-type channel, i.e., by the depthof the second recess 430A. Furthermore, in the conventionalhorizontal-type cell, a cell region is defined along the horizontaldirection; however, in this embodiment of the present invention, thecell region is formed along two directions (i.e., in a horizontaldirection and a vertical direction) to form a vertical-type structure toincrease the size of the cell region.

FIG. 5A illustrates a perspective view of the cell structure of thesemiconductor device shown in FIG. 4E. FIG. 5B represents a perspectiveview of the vertical-type channel shown in FIG. 4E.

As shown in FIGS. 5A and 5B, an active region 523 includes a firstsidewall 523A contacting a bit line junction region 532A, a secondsidewall 523B contacting a storage node junction region 532B, and a topsurface 523C, a third sidewalls 523D, and a fourth sidewall 523Econtacting a gate electrode 527.

The gate electrode 527 covers the top surface 523C, the third sidewall523D, and the fourth sidewall 523E of the active region 523. The bitline junction region 532A and the storage node junction region 532B arecontacting the first sidewall 523A and the second sidewall 523B,respectively.

A vertical-type channel is formed with a first channel V-CH1 (see thearrow on the third sidewall 523D) and a second channel V-CH2 (see thearrow on the fourth sidewall 523E).

A portion of a device isolation layer where a gate line traverses isetched to a predetermined thickness to form a first recess. A gateelectrode contacts a sidewall of the first recess. A region between thegate lines in which a bit line will contact is etched to a predeterminedthickness to form a second recess. An ion-implantation process isperformed to the second recess to form a bit line junction region.Accordingly, a vertical-type channel can be formed.

Furthermore, a vertical-type channel cell includes two channelstructures. The vertical-type channel cell uses two sidewalls of anactive region which the first recess provides as channels thereof.Accordingly, a cell current can be increased and as a result, a depth ofan active region can be reduced to reduce a cell operation voltage.

FIG. 6 shows a top view of a vertical channel device having avertical-type channel in accordance with a second embodiment of thepresent invention. FIG. 7A provides a cross-sectional view of a celltaken along a line I-I′ in FIG. 6 and FIG. 7B describes across-sectional view of the cell taken along a line II-II′ in FIG. 6.

Referring to FIG. 6 and FIGS. 7A and 7B, the vertical channel deviceincludes an active region 643 having a surface region 650B and aplurality of first recesses 650A lower than the surface region 650B, adevice isolation layer 642 surrounding the active region 643, at leastone pair of gate electrodes (also known as gate lines) 647 traversingover the surface region 650B of the active region 643 in the directionperpendicular to the active region 643, a plurality of second recesses645 formed in the device isolation layer 642 beneath the gate electrodes647 and including portions of the gate electrodes 647 filling the secondrecesses 645, a plurality of storage node junction regions 652A formedin the active region 643 beneath the first recesses 650A and contactinga storage node, and a bit line junction region 652B formed in thesurface region 650B on one side of the gate electrodes 647 andcontacting a bit line.

A plurality of gate spacers 651 are formed over sidewalls of the gatelines. A gate oxide layer 646 is formed beneath the gate electrode 647.A gate hard mask 648 is formed above the gate electrode 647.

In the above described structure, the vertical-type channel length‘V-CH’ is formed between the bit line junction region 652B and thestorage node junction region 652A beneath the gate electrode 647.

FIGS. 8A to 8E are cross-sectional views illustrating a method forfabricating the device shown in FIGS. 6 to 7B. The cross-sectional viewsassociated with a line I-I′ in FIG. 6 are provided on the left side. Thecross-sectional views associated with a line II-II′ in FIG. 6 areprovided on the right side.

As shown in FIG. 8A, a plurality of trench type device isolation layers842 are formed in a substrate 841. An active region 843 is defined bythe device isolation layers 842. The active region 843 is formed in anisland type by using a shallow trench isolation (STI) process.

As shown in FIG. 8B, a photoresist layer is formed over the aboveresulting structure and patterned by performing a photo-exposure processand a developing process to form a first photoresist pattern 844. Thephotoresist pattern 844 is a mask formed by reversing a gate mask topattern a subsequent gate electrode and traverses an upper portion ofthe active region 843. Accordingly, a plurality of first openings 844Abetween the first photoresist pattern 844 has a line type structureexposing a portion where a subsequent gate electrode is to be formed.

Predetermined portions of the device isolation layers 842 exposed by thefirst openings 844A by using the first photoresist pattern 844 as anetch mask are etched to form a plurality of first recesses 845. Theetching process to form the first recesses 845 is performed by using agas selectively etching the device isolation layers 842 which are formedwith an oxide-based layer. For instance, a fluorocarbon-based gasselected from a group comprising tetrafluoromethane (CF₄),octafluoropropane (C₃F₈) and trifluoromethane (CHF₃) can be used. Sincethe gas used in the etching process to form the first recesses 845 needsto have a high etch selectivity to a silicon-based active region 843,C₃F₈ or CHF₃ can also be used.

As shown in FIG. 8C, the first photoresist pattern 844 is stripped and agate oxide layer 846 is formed. Then, a plurality of gate electrodes 847and a plurality of gate hard masks 848 are sequentially formed over thefirst recesses 845 and afterwards, a gate patterning process isperformed to form a plurality of line type gate lines traversing overthe active region 843.

The gate electrodes 847 are formed with polysilicon or a stack structureof polysilicon and tungsten silicide. The gate electrodes 847sufficiently fill the first recesses 845, and a planarization processcan be additionally performed. The gate hard masks 848 are formed with asilicon nitride layer over the planarized gate electrodes 847.

During forming the above described gate lines, since the gate electrodes847 fills the first recesses 845, each of the gate electrodes 847 coverstwo sidewalls of the active region 843 and a top surface of the activeregion 843.

As shown in FIG. 8D, a photoresist layer is formed over the aboveresulting structure including the gate lines, and patterned by using aphoto-exposure process and a developing process to form a secondphotoresist pattern 849 exposing surfaces of the active region 843between the gate lines. A plurality of second openings 849A of thesecond photoresist pattern 849 are formed with a structure exposing atleast one side of the gate line or in a line type which does not exposethe gate line. A substrate and an active region exposed by the secondopenings 849A are provided with reference numerals 841A and 843Arespectively. Accordingly, the second photoresist pattern 849 covers theother side of the gate line or a top surface of the gate line, andexposes a surface of the exposed active region 843A between the gatelines and a predetermined portion of the device isolation layers 842contacting the exposed active region 843A.

The exposed active region 843A is etched to a predetermined thickness byusing the second photoresist pattern 849 as an etch mask to form aplurality of second recesses 850A. Although explained later, bottomportions of the second recesses 850A will be regions contacting storagenodes, and a surface region 850B of the exposed active region 843Aexcept for the second recesses 850A will be regions contacting a bitline.

In some embodiments, the second recess 850A is formed more thinly thanthe first recess 845 in which the gate electrode 847 is filled to reducea leakage current.

As a result, each of the second recesses 850A is formed with apredetermined thickness on one side of each of the gate electrodes 847.The regions where the second recesses 850A are formed represent regionswhere storage nodes will be formed. Since the etching process to formthe second recesses 850A selectively etches the substrate 841 formedwith a silicon material, hydrogen bromide (HBr) or chlorine (Cl₂) gascan be used.

As shown in FIG. 8E, the second photoresist pattern 849 is stripped toform a plurality of gate spacers 851 on sidewalls of the gate lines.More specifically, a silicon nitride layer is formed and then, subjectedto an etch-back to form the gate spacers 851. In lateral sides of thegate lines contacting the second recesses 850A, the gate spacers 851cover not only the sidewalls of the gate lines but also the sidewalls ofthe second recesses 850A. In an upper portion of the surface region 850Bwith which the bit line will contact, the spacers 850 cover thesidewalls of the gate lines.

An ion-implantation process using an ion-implantation barrier furthercomprising the gate lines and the gate spacers 851, or a separateion-implantation mask (not shown) is performed to form a plurality ofsource/drain regions. The source/drain regions formed by performing anion-implantation process to bottom portions of the second recesses 850Abecome regions where subsequent storage nodes contact and thus, will bereferred to as storage node junction regions 852A. The source/drainregion formed by performing the ion-implantation process to the surfaceregion 850B of the exposed active region 843A become a region where asubsequent bit line contacts and thus, will be referred to as a bit linejunction region 852B. In some embodiments, the bit line junction region852B and the storage node junction regions 852A are doped with N-typeimpurities.

As described above, the bit line junction region 852B and the storagenode junction regions 852A are formed between the gate lines to form acell transistor. A channel region is defined beneath a surface of theactive region 843 between the bit line junction region 852B and therespective storage node junction regions 852A. As illustrated, thechannel region has a channel length ‘V-CH’. The channel length ‘V-CH’ islonger than that of the conventional horizontal-type cell by the depthof the second recess 850A. The conventional horizontal-type cell has acell region defined along the horizontal direction; however, in thisembodiment of the present invention, the cell region is defined alongtwo directions (i.e., along horizontal and vertical directions) to forma vertical-type structure to increase the size of the cell region.

FIG. 9A illustrates a perspective view of the cell structure having thevertical-type channel shown in FIG. 8E. FIG. 9B represents a perspectiveview of the vertical-type channel shown in FIG. 8E.

As shown in FIGS. 9A and 9B, an active region 953 includes a firstsidewall 943A contacting a bit line junction region 952B, a secondsidewall 943B contacting a storage node junction region 952A, and a topsurface 943C, a third sidewalls 943D, and a fourth sidewall 943Econtacting a gate electrode 947.

The gate electrode 947 covers the top surface 943C, the third sidewall943D, and the fourth sidewall 943E of the active region 943. The bitline junction region 952B and the storage node junction region 952A arecontacting the first sidewall 943A and the second sidewall 943B,respectively.

A vertical-type channel is formed with a first channel V-CH1 (see thearrow on the third sidewall 943D) and a second channel V-CH2 (see thearrow on the fourth sidewall 943E).

In this embodiment of the present invention, a portion of a deviceisolation layer where a gate line traverses is etched to a predeterminedthickness to form a first recess. A gate electrode is contacting asidewall of the first recess. A region between the gate lines which abit line will contact is etched to a predetermined thickness to form asecond recess. An ion-implantation process is performed to the secondrecess to form a bit line junction region. Accordingly, a vertical-typechannel can be formed.

Furthermore, a vertical-type channel cell includes two channelstructures. The vertical-type channel cell uses two sidewalls of anactive region which the first recess provides as channels thereof.Accordingly, a cell current can be increased and as a result, a depth ofan active region can be reduced to reduce a cell operation voltage.

In accordance with the embodiment of the present invention, a channel ofa cell is formed in the vertical direction. The channel length can beincreased, and the refresh property can be improved.

Furthermore, a channel is formed through two sidewalls of an activeregion. Accordingly, a cell current can be increased, and a depth of theactive region can be decreased to reduce a cell operation voltage. As aresult, a cell can stably operate.

The present application contains subject matter related to the Koreanpatent application No. KR 2005-0132568, filed in the Korean PatentOffice on Dec. 28, 2005 the entire contents of which being incorporatedherein by reference.

While the present invention has been described with respect to certainembodiments, it will be apparent to those skilled in the art thatvarious changes and modifications may be made without departing from thespirit and scope of the invention as defined in the following claims.

1. A method for fabricating a semiconductor device, comprising: forminga device isolation layer with a trench type in a predetermined portionof a substrate to define an active region; etching predeterminedportions where gate lines traverse in the device isolation layer to acertain depth to form a plurality of first recesses; forming a pair ofgate lines filling the first recesses and traversing over the activeregion; etching portions of the active region which storage nodescontact on one sides of the gate lines to form a plurality of secondrecesses; and performing an ion-implantation process to form a pluralityof first junction regions beneath the second recesses and to form asecond junction region in a portion of the active region between thegate lines, the second junction region contacting bit lines.
 2. Themethod of claim 1, further comprising forming a plurality of gatespacers on sidewalls of the gate lines.
 3. The method of claim 2,wherein some of the gate spacers are formed on one sidewall of the gatelines over the second junction region, and the remaining gate spacersare formed not only on another sidewall of the gate lines but also onone sidewall of the second recesses.
 4. The method of claim 1, whereinthe forming of the first recesses includes: forming a first photoresistpattern having a plurality of openings exposing portions where the gatelines traverse over the device isolation layer; selectively etching thedevice isolation layer exposed beneath the openings by using the firstphotoresist pattern as an etch mask to form the first recesses; andremoving the first photoresist pattern.
 5. The method of claim 4,wherein the forming of the first recesses is performed by using a gashaving high etch selectivity to the active region during etching thedevice isolation layer.
 6. The method of claim 1, wherein the forming ofthe second recesses includes: forming a second photoresist patternexposing the portion of the active region between the gate lines overthe gate lines; selectively etching the exposed portion of the activeregion to a predetermined depth by using the second photoresist patternas an etch mask; and removing the second photoresist pattern.
 7. Themethod of claim 6, wherein the forming of the second recesses uses a gashaving high etch selectivity to the device isolation layer duringetching the exposed portion of the active region.
 8. The method of claim1, wherein the first junction regions and the second junction region aredoped with N-type impurities.